BGA Reballing System - BB2 - 98.0000 - BGA Reballing Kit - BGA Solder Sphere Placement System

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BB2 Reballing System

BB2
The BB2 is a kit designed for repairing BGAs and reposition soldering balls.

The Kit is a perfect solution for low volume BGA reballing, useful for reworking BGAs and for prototypes.

Fits most BGA layouts and sphere sizes.

The machine requires 5atm compressed air, air tube 6/4mm.

   The kit includes the following:

Base for BGA positioning

Centering Adaptor

Top Adaptor for soldering paste (stencil holder)

Top Adaptor for Soldering Balls

Tools

   NO STENCIL INCLUDED

The photos below show how the BB2 works:

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1. Place BGA in the middle of the adjustable brackets of the centering device. Turn knob until component in locked.
2. Place the centering device on the stationary section of the BB2.
3. The centering device will fit into place

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4. Turn the graduated knob until the sliding plane touches the BGA. Lock the knob on the opposite side.
5. Connect a 4/6 hose to the BB2 and turn the switch on in order to create a clamping force through vacuum to hold the BGA.
6. Loosen the side knob of the centering device to release the BGA. Take the centering device out.

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7. BGA stays locked at proper position.
8. Place the stencil holder assembly on the BB2
9. Spread a small quantity of paste with the spatula

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10. Replace the Stencil Holder Assembly with the adaptor for soldering balls
11. Open the small door and allow the balls to slide into the holes.
12. With the help of the brush, place balls inside the holes.

The exceeding balls should be returned behind the small door.

Remove the stencil holder assembly and disconnect he air switch.

Carefully take the BGA out of the unit.